Brief
The interface between the heat sink and the metal cover appears to have no gaps and is as smooth as an eggshell, but in fact there are tiny irregularities that are enough for air to exist and form an insulator, inhibiting the transfer of heat energy from high-temperature components. Thermal paste provides excellent gap-filling capabilities, allowing heat to be conducted smoothly.
Specification
| Specific gravity | 2.7g/cm3 |
| Adhesion | 330,000 cps |
| Thermal conductivity | 11.2 W/m-℃ |
| Thermal resistance | 0.013 ℃-in2/W |
| Feature | • High thermal conductivity • Low thermal resistance • Long-term stability • Low drying properties • Non-corrosive • Non-conductive • No "curing" time required |
BondMax® thermal paste is composed of specially formulated particles designed to perfect previously imperfect interfaces. These specially made particles will fill the tiny gaps on the interface, eliminating any possibility of air, allowing heat to be transferred away from the heating element smoothly and quickly.
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